ANSYS And TSMC Bring Automotive Reliability Solution Guide

 | Sep 15, 2017 04:45AM ET

ANSYS Inc. (NASDAQ:ANSS) recently collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) for an Automotive Reliability Solution Guide, which will help in accelerated development of new-age automotive features.

Coverage of the Guide

Notably, with advanced driver assistance system (ADAS) and autonomous driving systems steadily gaining pace, this collaboration is anticipated to be a positive for both companies as well as relevant technologies.

This is a first-of-its-kind guide that will support the aspects of automotive applications for TSMC’s 16-nanometer FinFET Compact Technology (16FFC) process and Automotive Design Enablement Platform (ADEP).

The guide will help optimize chips’ efficiency. It will outline the different processes to simulate and identify the problems in a chip and thereby perform electromigration, thermal and electrostatic discharge analysis to find a solution to the problems.

We believe that with ANSYS’ simulation solutions that enable access to instant feedback on chip designing related experiments, the guide will be more user-friendly. This is expected to increase the adoption rate of ANSYS’ offering as well improving its top line going forward.

Shares of ANSYS have gained 39.6% year to date, significantly outperforming the industry’s 28.5% rally.